With the continuous miniaturization and increasing circuit density in integrated circuits (IC's), it has resulted in smaller bonding pads on die and chip. Hence, the need for a small and consistent first bond on the pad is essential.
As noticed, usually when there is change of any new electrode (or virgin electrode), difficulty is encountered to produce constant ball size. This is due to new electrode's inability to lead the current to flow from a same point. Some time is needed to stabilize current flowing from a different displacement leading to a difference of energy absorbed by the bonded wire causing inconsistent ball size (Note-Electrical energy is proportional to gap voltage which includes a function of displacement).
With an extra process added to the electrode, current flow from a desired particular point is assured.
A wide range series of electrode wands to cater for all types of wire bonders are available. Enquiries for custom made electrodes are welcome.
